November 2023

Conference Paper

A communication-avoiding 3D sparse triangular solver

By:
Sao, Piyush K; Kannan, Ramakrishnan ; Li, Xiaoye; Vuduc, Richard
Page Number:
127-137
Book Title:
Proceeding ICS '19 Proceedings of the ACM International Conference on Supercomputing
Publication Date:
November 9, 2023
Publisher Location:
ACM, United States of America
Conference Name:
International Conference on Supercomputing (ICS 2019)
Conference Location:
Phoenix, Arizona, United States of America
Conference Sponsor:
ACM
View DOI Listing:
https://doi.org/10.1145/3330345.3330357

Abstract

We present a novel distributed memory algorithm to improve the strong scalability of the solution of a sparse triangular system. This operation appears in the solve phase of direct methods for solving general sparse linear systems, Ax = b. Our 3D sparse triangular solver employs several techniques, including a 3D MPI process grid, elimination tree parallelism, and data replication, all of which reduce the per-process communication when combined. We present analytical models to understand the communication cost of our algorithm and show that our 3D sparse triangular solver can reduce the per-process communication volume asymptotically by a factor of O(n1/4) and O(n1/6) for problems arising from the finite element discretizations of 2D "planar" and 3D "non-planar" PDEs, respectively. We implement our algorithm for use in SuperLU_DIST3D, using a hybrid MPI+OpenMP programming model. Our 3D triangular solve algorithm, when run on 12k cores of Cray XC30, outperforms the current state-of-the-art 2D algorithm by 7.2x for planar and 2.7x for the non-planar sparse matrices, respectively.