Computational Approach to Photonic Drilling of Silicon Carbide

Abstract

The ability of lasers to carry out drilling processes in silicon carbide ceramic was investigated in this study. A JK 701 pulsed Nd:YAG laser was used for drilling through the entire depth of silicon carbide plates of different thicknesses. The laser parameters were varied in different combinations for a well controlled drilling through the entire thickness of the SiC plates. A drilling model incorporating effects of various physical phenomena such as decomposition, evaporation induced recoil pressure, and surface tension was developed. Such comprehensive model was capable of advance prediction of the energy and time required for drilling a hole through any desired depth of material.