November 2023

Conference Paper

Field Study of Thermal and Hygrothermal Performance on Attics with Various Retrofitting Strategies

By:
Shiao, Ming; Railkar, Sudhir; Miller, William A
Book Title:
NA
Publication Date:
November 9, 2023
Publisher Location:
RCI, Inc., United States of America
Conference Name:
RCI Building Envelope Technology Symposium
Conference Location:
Orlando, Florida, United States of America
Conference Sponsor:
RCI