November 2023

Conference Paper

High-Temperature Creep Properties of SiC Fibers with Different Compositions

By:
Patel, Deep; Koyanagi, Takaaki
Journal Name:
Fusion Science and Technology
Page Number:
636-641
Volume:
75
Issue Number:
7
Publication Date:
November 9, 2023
Conference Name:
Embedded Topical 23rd Topical Meeting on the Technology of Fusion Energy (TOFE 2018)
Conference Location:
Orland, Florida, United States of America
Conference Sponsor:
NETZSCH
View DOI Listing:
https://doi.org/10.1080/15361055.2019.1647029

Abstract

Silicon carbide (SiC) fiber–reinforced SiC matrix (SiC/SiC) composites have been widely investigated for potential fusion reactor applications. In this present investigation, the high-temperature creep performance of five types of SiC fibers is evaluated and microstructural analysis is performed. The creep behavior of the fibers was assessed by the bend stress relaxation method at various applied strains at 1500°C and 1700°C. The fibers tested include developmental-grade fibers with different residual silicon amounts (~0%, 2% to 3%, and 5% to 6%) fabricated by laser chemical vapor deposition at Free Form Fibers. Generally, the creep behavior of the Free Form (FF) fibers was similar to Hi-Nicalon Type S and/Tyranno-SA SiC fibers currently used for fabrication of SiC/SiC composites for fusion applications. However, all FF fibers exhibited the formation of pores after the creep tests at 1700°C regardless of residual silicon amount, which can be improved by further development via optimization of the composition and microstructure.


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