November 2023

Conference Paper

Real-World Experiences Adopting Workflows at Exascale on the ExaAM Project

By:
Malviya Thakur, Aditi A; Milewicz, Reed; Grayson, Samuel; Fackler, Philip W; Belak, James; Turner, John A
Page Number:
468-474
Book Title:
2022 IEEE 18th International Conference on e-Science (e-Science) Proceedings
Publication Date:
November 9, 2023
Publisher Location:
IEEE, New Jersey, United States of America
Conference Name:
IEEE International Conference on e-Science 2022
Conference Location:
Salt Lake City, Utah, United States of America
Conference Sponsor:
IEEE
View DOI Listing:
https://doi.org/10.1109/eScience55777.2022.00084

Abstract

The purpose of this study is to discuss the experiential lessons associated with adopting scientific workflows in the Exascale Additive Manufacturing project (ExaAM) through the lens of Perceived Characteristic of Innovation (PCI). Besides the implementation, the factors we considered critical to the adoption of the workflow are provenance, sustainable automation, implementation challenges, and integration/compatibility challenges. Through conversations and interviews among the program managers, project leads, and software engineers, we have developed critical insight and strategies to overcome the obstacles and augment the successful adoption and long-term use of these workflows in ExaAM and beyond. We hope our work will pave the way for others in the research community to develop and use workflows in their respective science domains.