Bonding Strategy for Large Area Metal-Cladded Ceramic Substrate

The combination of mating concentric ground surfaces and use of hexagonal-arrayed print pattern of the bonding material (e.g., sinterable silver paste) will produce Ag sinter interconnects with maximized heat transfer, shear strength, and thermal cycling resistance. These are all important attributes needed for successfully operating power electronic devices having relatively large size (e.g., size > a couple square centimeters). This will enable more efficient and inexpensive thermal management options for power electronic devices while concomitantly producing better device reliability.

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